Summit ATC or PTC
Single or Dual, Chamberless Pick-and-Place Handler for High Power Dissipation Applications

Designed for high power devices that need to dissipate head generated while under stress. The Summit handler uses an innovative thermal conditioning system to maintain package setpoint within an operating range during test. The thermal system is a "chamberless design" that can dissipate the heat generated by high power devices during test, provides lower soak time and enables more efficient and accurate testing of high power devices. The Summit handler is available in two versions, passive thermal control, or active thermal control with feedback sensor. All input and output functions are fully automated.